Advanced Micro Devices Inc. (AMD) announced on Thursday that it is investing more than $10 billion in Taiwan to improve the artificial intelligence infrastructure.
The chipmaker revealed that the investment will include scaling advanced packaging manufacturing for the next generation of AI infrastructure, as well as strategic partnerships across Taiwan, such as Taiwan-based ASE Technology Holding Co., Ltd. and Siliconware Precision Industries Co., Ltd., to develop and qualify next-generation wafer-based 2.5D bridge interconnect technology, leading to a stronger elevated-fanout-bridge (EFB) architecture that supports AMD's new Venice chips.
AMD stated that it is boosting production of its Venice chips, which are the company's next-generation EPYC processors, on Taiwan Semiconductor Manufacturing Co.'s (TSMC) 2-nanometer process technology, making it the first high-performance computing (HPC) product to achieve production boost on this TSMC technology. The company also said it has plans to expand the output at TSMC's Arizona fabrication site in the future.
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